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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11052649 B1

PDFFull Text
Date of Patent:
Jul. 06, 2021

Filed:

Jun. 13, 2018

Resin powder for solid freeform fabrication, device for fabricating solid freeform fabrication object, and resin powder

Applicants:

Akira Saito, Kanagawa, JP;

Shigenori Yaguchi, Tokyo, JP;

Yasuo Suzuki, Shizuoka, JP;

Nozomu Tamoto, Shizuoka, JP;

Shinzo Higuchi, Tokyo, JP;

Hitoshi Iwatsuki, Kanagawa, JP;

Inventors:

Akira Saito, Kanagawa, JP;

Shigenori Yaguchi, Tokyo, JP;

Yasuo Suzuki, Shizuoka, JP;

Nozomu Tamoto, Shizuoka, JP;

Shinzo Higuchi, Tokyo, JP;

Hitoshi Iwatsuki, Kanagawa, JP;

Assignee:

Ricoh Company, Ltd., Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Sanza L McClendon

Int. Cl.
CPC ...
B33Y 70/00 (2020.01); C08K 5/52 (2006.01); C08K 5/09 (2006.01); C08K 5/1575 (2006.01); C08K 5/372 (2006.01); C08K 5/521 (2006.01); B29C 64/153 (2017.01); C08L 71/00 (2006.01); C08L 77/06 (2006.01); C08L 59/00 (2006.01); B33Y 10/00 (2015.01); C08L 77/02 (2006.01); C08K 5/00 (2006.01); B29K 71/00 (2006.01); B29K 105/00 (2006.01); B29K 77/00 (2006.01); B29K 67/00 (2006.01); B33Y 30/00 (2015.01); B29K 23/00 (2006.01); C08L 23/12 (2006.01); C08K 5/36 (2006.01); C08K 5/49 (2006.01); C08K 5/098 (2006.01); C08K 5/13 (2006.01);
U.S. Cl.
CPC ...
B33Y 70/00 (2014.12); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); C08K 5/005 (2013.01); C08K 5/09 (2013.01); C08K 5/1575 (2013.01); C08K 5/372 (2013.01); C08K 5/52 (2013.01); C08K 5/521 (2013.01); C08L 59/00 (2013.01); C08L 71/00 (2013.01); C08L 77/02 (2013.01); C08L 77/06 (2013.01); B29K 2023/12 (2013.01); B29K 2067/006 (2013.01); B29K 2071/00 (2013.01); B29K 2071/02 (2013.01); B29K 2077/00 (2013.01); B29K 2105/0017 (2013.01); B29K 2105/0094 (2013.01); B29K 2105/251 (2013.01); B29K 2995/0077 (2013.01); B29K 2995/0094 (2013.01); B29K 2995/0098 (2013.01); B33Y 30/00 (2014.12); C08K 5/098 (2013.01); C08K 5/13 (2013.01); C08K 5/36 (2013.01); C08K 5/49 (2013.01); C08L 23/12 (2013.01);
Abstract

A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.

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