The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Apr. 21, 2018
Applicant:

Arevo, Inc., Santa Clara, CA (US);

Inventor:

Steven George Manuel, San Mateo, CA (US);

Assignee:

Arevo, Inc., Milpitas, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/209 (2017.01); B29C 64/218 (2017.01); B29C 64/118 (2017.01); B29C 64/245 (2017.01); B29C 64/295 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/209 (2017.08); B29C 64/118 (2017.08); B29C 64/218 (2017.08); B29C 64/245 (2017.08); B29C 64/295 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12);
Abstract

In a 3D-printing system, a deposition head comprising a band assembly having a body and a band for compacting a filament onto the surface of an object being manufactured. One or more actuators are mounted on the assembly body at a front mounting point or a rear mounting point, or both, and are used to shape the band to a desired contour. The band is made of a flexible material, and has a first and second connecting point, wherein at least one of them is connected to the one or more actuators. The intermediate portion of the band between the connecting points is curved toward the surface of the object being manufactured to enable the portion to come into contact with and to compact the filament onto the object. The band assembly further comprises a compaction support extending from the assembly body toward an inward-facing surface of the band.


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