The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
May. 11, 2017
Honda Motor Co., Ltd., Tokyo, JP;
Subaru Corporation, Tokyo, JP;
Suzuki Motor Corporation, Hamamatsu, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Teijin Limited, Osaka, JP;
Toray Industries, Inc., Tokyo, JP;
Kyowa Industrial Co., Ltd., Sanjo, JP;
National University Corporation Nagoya University, Nagoya, JP;
Satoshi Hirawaki, Saitama, JP;
Masashi Horikawa, Niigata, JP;
Shusuke Sanai, Shizuoka, JP;
Kanji Takaoka, Aichi, JP;
Kazuaki Amaoka, Aichi, JP;
Munehito Kawakami, Tokyo, JP;
Kazuki Baba, Tokyo, JP;
HONDA MOTOR CO., LTD., Tokyo, JP;
SUBARU CORPORATION, Tokyo, JP;
SUZUKI MOTOR CORPORATION, Hamamatsu, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Aichi, JP;
TEIJIN LIMITED, Osaka, JP;
TORAY INDUSTRIES, INC., Tokyo, JP;
KYOWA INDUSTRIAL CO., LTD., Sanjo, JP;
NATIONAL UNIVERSITY CORPORATION, Nagoya, JP;
Abstract
A molding method and a molding system for improving a molding speed of a resin molded member. In the method, firstly a thermoplastic resin composite material is filled in a metal mold (i.e., at time T), and subsequently a mold-clamping process gets started. As the mold-clamping process progresses, a first decompression circuit starts to decompress an inside of a cavity when the cavity is closed by a sealing member provided on the metal mold. Then, as the mold-clamping process further progresses, the thermoplastic resin composite material thus filled in the metal mold contacts an upper mold of the metal mold (i.e., at time T). After that, a second decompression circuit starts to decompress the inside of the cavity, thereby to complete the mold-clamping process (i.e., at time T).