The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Oct. 05, 2018
Applicant:

Amada Holdings Co., Ltd., Kanagawa, JP;

Inventors:

Yuya Mizoguchi, Kanagawa, JP;

Hiroaki Ishiguro, Kanagawa, JP;

Ryohei Ito, Kanagawa, JP;

Ryo Kobayashi, Kanagawa, JP;

Kenji Masuda, Kanagawa, JP;

Assignee:

AMADA HOLDINGS CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); B23K 26/14 (2014.01); B23K 26/40 (2014.01); B23K 101/18 (2006.01); B23K 103/02 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/1436 (2015.10); B23K 26/1476 (2013.01); B23K 26/1482 (2013.01); B23K 26/40 (2013.01); B23K 2101/18 (2018.08); B23K 2103/02 (2018.08);
Abstract

In a laser processing method, laser lights of fiber lasers or direct diode lasers is irradiated onto an iron-based plate material from a nozzle, a nozzle with a nozzle opening whose opening diameter is preliminarily set according to a thickness of the plate material is selected from plural nozzles whose nozzle openings have different opening diameters from each other, and the plate material is cut while irradiating the laser lights onto the plate material and injecting assist gas from the nozzle opening toward the plate material.


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