The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Apr. 09, 2018
Applicant:

Konica Minolta Inc., Chiyoda-ku Tokyo, JP;

Inventor:

Hirokazu Fukase, Kawasaki Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); H01L 41/04 (2006.01); G01N 29/32 (2006.01); A61B 8/00 (2006.01); G01N 29/24 (2006.01); G01N 29/22 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0685 (2013.01); A61B 8/4444 (2013.01); B06B 1/067 (2013.01); G01N 29/223 (2013.01); G01N 29/2437 (2013.01); G01N 29/32 (2013.01); H01L 41/04 (2013.01); B06B 2201/76 (2013.01); G01N 2291/02475 (2013.01);
Abstract

An ultrasonic probe includes: an acoustic element that generates an ultrasonic wave and detects the ultrasonic wave; a support that supports the acoustic element on a side opposite to a test object side; and a heat dissipation material disposed on a side of the support opposite to the acoustic element, wherein an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material is disposed in contact with the heat dissipation material.


Find Patent Forward Citations

Fukase, Hirokazu. (2021). Ultrasonic probe with heat dissipation (U.S. Patent No. 11052425). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11052425

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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