The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Jul. 03, 2019
Applicant:

Creative Coatings Co., Ltd., Tokyo, JP;

Inventors:

Eiji Sato, Tokyo, JP;

Hitoshi Sakamoto, Nagaoka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/00 (2006.01); B05D 1/18 (2006.01); H01G 13/00 (2013.01); H01C 17/28 (2006.01); H05K 1/18 (2006.01); B05C 3/09 (2006.01); B05C 13/02 (2006.01); H01G 2/06 (2006.01); H01G 4/005 (2006.01);
U.S. Cl.
CPC ...
B05D 1/18 (2013.01); B05C 3/09 (2013.01); B05C 13/02 (2013.01); H01C 17/28 (2013.01); H01G 2/06 (2013.01); H01G 4/005 (2013.01); H01G 13/006 (2013.01); H05K 1/185 (2013.01);
Abstract

An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).


Find Patent Forward Citations

Loading…