The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Nov. 27, 2018
Applicant:
Flextronics Ap, Llc, San Jose, CA (US);
Inventors:
Assignee:
FLEXTRONICS AP, LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H01L 23/48 (2006.01); D03D 1/00 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01); H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/038 (2013.01); D03D 1/0088 (2013.01); H01L 23/48 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 3/32 (2013.01); D03D 2700/0166 (2013.01); H05K 1/0283 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 1/113 (2013.01); H05K 3/42 (2013.01); H05K 9/009 (2013.01); H05K 2201/05 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10303 (2013.01);
Abstract
An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.