The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Feb. 29, 2016
Applicant:
Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;
Inventors:
Mingzhu Wang, Ningbo, CN;
Nan Guo, Ningbo, CN;
Feifan Chen, Ningbo, CN;
Bojie Zhao, Ningbo, CN;
Bo Peng, Ningbo, CN;
Zhen Huang, Ningbo, CN;
Assignee:
Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); G02B 7/09 (2021.01); H04N 5/225 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); G02B 7/09 (2013.01); H04N 5/2253 (2013.01); H05K 3/0014 (2013.01); H05K 3/32 (2013.01); H05K 3/46 (2013.01); H05K 3/0052 (2013.01); H05K 3/0058 (2013.01); H05K 3/20 (2013.01); H05K 3/4673 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/2018 (2013.01);
Abstract
A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.
Quick Actions:
Wang, Mingzhu. (2021). Camera module with compression-molded circuit board and manufacturing method thereof (U.S. Patent No. 11051400). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11051400
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile