The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Apr. 29, 2019
Applicant:
Fortemedia, Inc., Santa Clara, CA (US);
Inventors:
Li-Jen Chen, Hsinchu, TW;
Yu-Min Fu, Hsinchu, TW;
Yu-Ting Cheng, Hsinchu, TW;
Shih-Chin Gong, Taipei, TW;
Assignee:
FORTEMEDIA, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/00 (2006.01); H04R 7/02 (2006.01); H05K 1/18 (2006.01); H04R 9/02 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H04R 7/02 (2013.01); H01F 27/2804 (2013.01); H04R 9/025 (2013.01); H05K 1/181 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/10083 (2013.01);
Abstract
A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.