The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Sep. 25, 2019
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventor:

Atsushi Takano, Kadoma, JP;

Assignee:

SKYWORKS SOLUTIONS, INC., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H03H 9/10 (2006.01); H03H 3/02 (2006.01); H03H 9/17 (2006.01); H03H 9/05 (2006.01); H01L 41/313 (2013.01); H01L 41/338 (2013.01); H01L 23/00 (2006.01); H01L 41/337 (2013.01); B23K 26/382 (2014.01); B23K 1/00 (2006.01); B23K 26/402 (2014.01); B23K 20/16 (2006.01); H01L 21/18 (2006.01); H01L 25/065 (2006.01); H03H 9/70 (2006.01); B23K 101/36 (2006.01); B23K 103/16 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1035 (2013.01); B23K 1/0016 (2013.01); B23K 20/16 (2013.01); B23K 26/382 (2015.10); B23K 26/402 (2013.01); H01L 21/187 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 41/313 (2013.01); H01L 41/337 (2013.01); H01L 41/338 (2013.01); H03H 3/02 (2013.01); H03H 9/0523 (2013.01); H03H 9/17 (2013.01); H03H 9/171 (2013.01); H03H 9/173 (2013.01); H03H 9/175 (2013.01); B23K 2101/36 (2018.08); B23K 2101/42 (2018.08); B23K 2103/172 (2018.08); H01L 24/94 (2013.01); H01L 2224/8312 (2013.01); H01L 2224/83096 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01079 (2013.01); H03H 9/706 (2013.01); H03H 2003/021 (2013.01);
Abstract

An electronic device includes a first substrate and a second substrate. A side wall joins the first substrate to the second substrate. The side wall includes a first alloy layer of a first metal and a second metal bonded directly to an upper surface of the first substrate and a second alloy layer of the first metal and a third metal disposed on top of the first alloy layer and bonded directly to a lower surface of the second substrate, the second metal and the third metal being different from each other and from the first metal. An electronic circuit is disposed on the lower surface of the second substrate within a cavity defined by the lower surface of the first substrate, the upper surface of the second substrate, and the side wall.


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