The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Oct. 23, 2018
Applicant:

Keyence Corporation, Osaka, JP;

Inventors:

Masao Sato, Osaka, JP;

Yu Takabatake, Osaka, JP;

Hideki Yamakawa, Osaka, JP;

Assignee:

KEYENCE CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/11 (2006.01); B23K 26/36 (2014.01); B23K 26/082 (2014.01); G02B 26/10 (2006.01); H01S 3/0941 (2006.01); H01S 3/109 (2006.01); H01S 3/04 (2006.01); H01S 3/00 (2006.01); H01S 3/16 (2006.01); H01S 3/042 (2006.01); H01S 3/08 (2006.01); H01S 3/091 (2006.01); H01S 3/06 (2006.01); B23K 26/352 (2014.01); H01S 3/02 (2006.01); B23K 26/042 (2014.01); B23K 26/064 (2014.01); B23K 26/06 (2014.01); B23K 26/03 (2006.01); H01S 3/102 (2006.01); B23K 26/0622 (2014.01); B23K 26/38 (2014.01); B23K 26/046 (2014.01); H01S 3/10 (2006.01); H01S 3/081 (2006.01); H01S 3/23 (2006.01);
U.S. Cl.
CPC ...
H01S 3/11 (2013.01); B23K 26/032 (2013.01); B23K 26/042 (2015.10); B23K 26/046 (2013.01); B23K 26/064 (2015.10); B23K 26/0622 (2015.10); B23K 26/0648 (2013.01); B23K 26/0665 (2013.01); B23K 26/082 (2015.10); B23K 26/355 (2018.08); B23K 26/36 (2013.01); B23K 26/38 (2013.01); G02B 26/101 (2013.01); G02B 26/105 (2013.01); H01S 3/0071 (2013.01); H01S 3/025 (2013.01); H01S 3/027 (2013.01); H01S 3/042 (2013.01); H01S 3/0405 (2013.01); H01S 3/061 (2013.01); H01S 3/08013 (2013.01); H01S 3/0912 (2013.01); H01S 3/0941 (2013.01); H01S 3/109 (2013.01); H01S 3/1022 (2013.01); H01S 3/1611 (2013.01); H01S 3/1673 (2013.01); H01S 3/0401 (2013.01); H01S 3/0815 (2013.01); H01S 3/09415 (2013.01); H01S 3/10069 (2013.01); H01S 3/2391 (2013.01);
Abstract

To prevent an output decrease of laser light due to impurities formed in a Q switch. A laser machining device includes a Q-switch housing section configured by housing a Q switch and a first mirror and a wavelength converting section including a housing in which a transmission window section capable of transmitting a fundamental wave is formed, the wavelength converting section being configured by airtightly housing, with an internal space surrounded by the housing, at least a first wavelength conversion element, a second wavelength conversion element, and a second mirror. A resonator forming a resonant optical path passing through the transmission window section is configured by the first mirror in the Q-switch housing section and the second mirror in the wavelength converting section.


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