The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Feb. 28, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Kyungjin Jeon, Yongin-si, KR;

Joonseok Park, Yongin-si, KR;

Soyoung Koo, Yongin-si, KR;

Myounghwa Kim, Yongin-si, KR;

Eoksu Kim, Yongin-si, KR;

Taesang Kim, Yongin-si, KR;

Hyungjun Kim, Yongin-si, KR;

Yeonkeon Moon, Yongin-si, KR;

Geunchul Park, Yongin-si, KR;

Sangwoo Sohn, Yongin-si, KR;

Junhyung Lim, Yongin-si, KR;

Hyelim Choi, Yongin-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 29/78 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 27/12 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3279 (2013.01); H01L 27/3248 (2013.01); H01L 27/3258 (2013.01); H01L 27/3265 (2013.01); H01L 51/524 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 27/124 (2013.01); H01L 27/1248 (2013.01); H01L 27/1255 (2013.01); H01L 27/1288 (2013.01); H01L 28/60 (2013.01); H01L 2227/323 (2013.01);
Abstract

A display device includes: a substrate; a first thin film transistor and a second thin film transistor arranged over the substrate; a display element connected to the first thin film transistor; a wiring connected to the second thin film transistor and including a first wiring layer and a second wiring layer; a pattern insulating layer arranged between the first wiring layer and the second wiring layer; a planarization layer covering the wiring; and a connection electrode arranged on the planarization layer and connected to the first wiring layer and the second wiring layer respectively through a first contact hole and a second contact hole.


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