The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Jun. 08, 2017
Ningbo Sunny Opotech Co., Ltd., Yuyao, CN;
Mingzhu Wang, Yuyao, CN;
Nan Guo, Yuyao, CN;
Jingfei He, Yuyao, CN;
Zhenyu Chen, Yuyao, CN;
Bojie Zhao, Yuyao, CN;
Takehiko Tanaka, Yuyao, CN;
Feifan Chen, Yuyao, CN;
Ye Wu, Yuyao, CN;
Zhen Huang, Yuyao, CN;
Zhongyu Luan, Yuyao, CN;
Ningbo Sunny Opotech Co., Ltd., Yuyao, CN;
Abstract
A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.