The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Mar. 11, 2019
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventor:

Tsuyoshi Sugisaki, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11573 (2017.01); H01L 27/11578 (2017.01); H01L 27/1157 (2017.01); H01L 27/11565 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11573 (2013.01); H01L 27/1157 (2013.01); H01L 27/11565 (2013.01); H01L 27/11578 (2013.01);
Abstract

According to one embodiment, a semiconductor memory device includes a semiconductor substrate, a memory cell array, first circuitry and a via. The semiconductor substrate includes a first main surface and a second main surface opposite the first main surface. The memory cell array is provided on the first main surface. The memory cell array includes stacked memory cells. The first circuitry is provided on the second main surface. The first circuitry is configured to operate the memory cells. The via penetrates through the semiconductor substrate. The via provides electrical connection between the memory cells and the first circuitry.


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