The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Jan. 15, 2019
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventors:
Ai Jun Song, Jamison, PA (US);
Jeremy Neyhart, Coopersburg, PA (US);
Thomas Colosimo, West Chester, PA (US);
Benjamin D. Trabin, Lansdale, PA (US);
Matthew B. Wasserman, Philadelphia, PA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/00 (2019.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 1/008 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 3/087 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 2224/75756 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81986 (2013.01); H01L 2224/83136 (2013.01);
Abstract
A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.