The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Aug. 14, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Chad Andrew Marquart, Austin, TX (US);
Daniel M. Dreps, Georgetown, TX (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/528 (2006.01); H03K 19/0185 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/4857 (2013.01); H01L 23/5286 (2013.01); H01L 23/5381 (2013.01); H01L 23/5386 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H03K 19/018521 (2013.01); H01L 2224/16225 (2013.01);
Abstract
An input/output (I/O) interface of a die is disclosed. The I/O interface of the die includes a first region of a backside of the die. The I/O interface further includes a second region of the backside surface of the die positioned along at least a portion of a perimeter of the first region. The second region provides power and ground connections to the first region.