The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Oct. 17, 2019
Applicant:

Viasat, Inc., Carlsbad, CA (US);

Inventors:

Steven J. Franson, Scottsdale, AZ (US);

Joseph J. Luna, Gilbert, AZ (US);

Assignee:

VIASAT, INC., Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/538 (2006.01); G03F 7/20 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49822 (2013.01); H01Q 1/2283 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6677 (2013.01);
Abstract

Disclosed is an antenna apparatus including a radiating layer with a plurality of antenna elements forming an antenna array; a semiconductor wafer including multiple tiles each having beamforming circuits; and a multi-layer interposer. The multi-layer interposer may include: a lower dielectric layer adjacent to the substrate; an upper dielectric layer adjacent to the radiating layer; a metal layer between the lower and upper layers and including a plurality of conductive traces; a plurality of first vias extending through both the upper and lower layers and electrically coupling the beamforming circuits to the plurality of antenna elements; and a plurality of second vias extending between the beamforming circuits and the conductive traces to interconnect the tiles.


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