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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11049821 B1

PDFFull Text
Date of Patent:
Jun. 29, 2021

Filed:

Feb. 14, 2019

Circuit module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Takayoshi Obata, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/13 (2013.01); H01L 23/145 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 24/16 (2013.01); H05K 1/02 (2013.01); H05K 3/28 (2013.01); H01L 23/4985 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/351 (2013.01);
Abstract

Breakage of a board due to local concentration of stress at the time when a circuit module deforms is reduced. A circuit module includes a base, a lower layer, and a surface layer. The base has a mounting region in which an electronic component is mounted. The lower layer is made of a resin material. The lower layer is formed over from the mounting region to a region other than the mounting region on the base. The surface layer is made of a resin material different in hardness from the resin material of the lower layer. A periphery of the surface layer is located outside the mounting region and inside a region in which the lower layer is formed.

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