The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Feb. 25, 2019
Nxp B.v., Eindhoven, NL;
Chayathorn Saklang, Bangplee, TH;
Amornthep Saiyajitara, Bangkok, TH;
Chanon Suwankasab, Pathumthani, TH;
Russell Joseph Lynch, West Bloomfield, MI (US);
NXP B.V., Eindhoven, NL;
Abstract
A shielded semiconductor device has a first die attached to a die pad of a lead frame and a second die attached to a surface of the first die. The first die is electrically connected to inner lead ends of leads that surround the die pad, and the second die is electrically connected to the first die and to an inner end of a shielding lead. A mold compound forms a body around the first and second dies and the electrical connections. Outer lead ends of the leads project from the sides of the body. The outer end of the shielding lead projects from a central location of one side of the body and is bent up the side surface from which it projects and over the top of the body and provides EMI shielding.