The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Oct. 20, 2016
Achilles Corporation, Tokyo, JP;
Masayuki Nishijima, Tokyo, JP;
Kenichi Hirose, Tokyo, JP;
ACHILLES CORPORATION, Tokyo, JP;
Abstract
Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.