The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Mar. 09, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Je Jung Kim, Suwon-si, KR;

Seung Ryeol Lee, Suwon-si, KR;

Su Kyoung Cha, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/232 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/12 (2013.01); H01G 4/2325 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01);
Abstract

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, and including first to sixth surfaces, a first external electrode including a first electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a first conductive resin layer, and a second external electrode including a second electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a second conductive resin layer. R1 and R2 satisfy R1>R2, in which R1 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second electrode layers, and R2 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second conductive resin layers.


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