The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

May. 11, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

David Alan Frey, West Chester, OH (US);

Kirk Douglas Gallier, Liberty Township, OH (US);

Herbert Chidsey Roberts, Middletown, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01D 5/18 (2006.01); F01D 5/28 (2006.01); F04D 29/58 (2006.01); F01D 5/14 (2006.01); F04D 29/38 (2006.01); B23P 15/02 (2006.01); F01D 9/02 (2006.01); F01D 25/12 (2006.01); F04D 29/32 (2006.01); F04D 29/54 (2006.01);
U.S. Cl.
CPC ...
F01D 5/186 (2013.01); B23P 15/02 (2013.01); F01D 5/147 (2013.01); F01D 5/187 (2013.01); F01D 5/284 (2013.01); F01D 9/02 (2013.01); F01D 25/12 (2013.01); F04D 29/324 (2013.01); F04D 29/38 (2013.01); F04D 29/388 (2013.01); F04D 29/542 (2013.01); F04D 29/582 (2013.01); F04D 29/584 (2013.01); B23P 2700/06 (2013.01); F05D 2220/32 (2013.01); F05D 2230/10 (2013.01); F05D 2230/50 (2013.01); F05D 2230/90 (2013.01); F05D 2250/185 (2013.01); F05D 2260/202 (2013.01); F05D 2260/204 (2013.01); F05D 2300/608 (2013.01); F05D 2300/6033 (2013.01);
Abstract

CMC components having microchannels and methods for forming microchannels in CMC components are provided. For example, a method for forming microchannels in a CMC component comprises laying up a plurality of body plies for forming a body of the CMC component; laying up a microchannel ply on the plurality of body plies that has at least one void therein for forming at least one microchannel; laying up a cover ply on the microchannel ply to define an outer layer of the CMC component; and processing the laid up body plies, microchannel ply, and cover ply to form the CMC component. In another embodiment, the method comprises applying an additive matrix to the body plies to define at least one microchannel. In still other embodiments, the method comprises machining at least one microchannel in the plurality of body plies.


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