The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Apr. 24, 2015
Applicant:

Okuno Chemical Industries Co., Ltd., Osaka, JP;

Inventors:

Shingo Nagamine, Osaka, JP;

Koji Kita, Osaka, JP;

Kuniaki Otsuka, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/22 (2006.01); C23C 18/30 (2006.01); C08J 7/14 (2006.01); C25F 1/00 (2006.01); C23C 18/24 (2006.01); C25D 5/14 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C08J 7/00 (2006.01); C08J 7/12 (2006.01); C23C 18/38 (2006.01); C23C 18/42 (2006.01); C23C 18/50 (2006.01); C25D 3/38 (2006.01); C23C 18/32 (2006.01);
U.S. Cl.
CPC ...
C23C 18/24 (2013.01); C08J 7/00 (2013.01); C08J 7/12 (2013.01); C08J 7/14 (2013.01); C23C 18/163 (2013.01); C23C 18/1641 (2013.01); C23C 18/1675 (2013.01); C23C 18/2086 (2013.01); C23C 18/22 (2013.01); C23C 18/30 (2013.01); C23C 18/38 (2013.01); C23C 18/42 (2013.01); C23C 18/50 (2013.01); C25D 5/14 (2013.01); C25F 1/00 (2013.01); C23C 18/1653 (2013.01); C23C 18/32 (2013.01); C25D 3/38 (2013.01);
Abstract

The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.


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