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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11046848 B1

PDFFull Text
Date of Patent:
Jun. 29, 2021

Filed:

Jul. 26, 2019

Heat-curable resin composition for semiconductor encapsulation and semiconductor device

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Yoshihiro Tsutsumi, Annaka, JP;

Naoyuki Kushihara, Annaka, JP;

Yuki Kudo, Annaka, JP;

Norifumi Kawamura, Annaka, JP;

Yoshihira Hamamoto, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C08L 63/00 (2006.01); H01L 23/29 (2006.01); C08G 59/62 (2006.01); C08G 77/26 (2006.01); C08K 3/013 (2018.01); C08G 59/50 (2006.01); C08L 83/08 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/5046 (2013.01); C08G 59/621 (2013.01); C08G 77/26 (2013.01); C08K 3/013 (2018.01); C08L 83/08 (2013.01); H01L 23/296 (2013.01); C08L 2203/20 (2013.01); C08L 2203/206 (2013.01);
Abstract

Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains:

Find Patent Forward Citations

Tsutsumi, Yoshihiro. (2021). Heat-curable resin composition for semiconductor encapsulation and semiconductor device (U.S. Patent No. 11046848). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11046848

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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