The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Jul. 29, 2019
Nova Chemicals (International) S.a., Fribourg, CH;
Vinod Konaganti, Calgary, CA;
Sepideh Kasiri, Calgary, CA;
Shivendra Goyal, Calgary, CA;
Monika Kleczek, Calgary, CA;
Fazle Sibtain, Calgary, CA;
Marzieh Ebrahimi, Calgary, CA;
NOVA Chemicals (International) S.A., Fribourg, CH;
Abstract
An ethylene copolymer composition comprises: a first ethylene copolymer having a density of from 0.855 to 0.913 g/cm, a molecular weight distribution, M/Mof from 1.7 to 2.3, and a melt index, Iof from 0.1 to 20 g/10 min; a second ethylene copolymer having a density of from 0.875 to 0.936 g/cm, a molecular weight distribution, M/Mof from 2.3 to 6.0, and a melt index, Iof from 0.3 to 100 g/10 min; and optionally a third ethylene copolymer; where the first ethylene copolymer has more short chain branches per thousand carbon atoms than the second ethylene copolymer and the density of the second ethylene copolymer is equal to or higher than the density of the first ethylene copolymer. The ethylene copolymer composition has a density of from 0.865 to 0.913 g/cm; a melt index, Iof from 0.5 to 10 g/10 min; and a fraction eluting at from 90 to 105° C., having an integrated area of greater than 4 weight percent in a CTREF analysis; and at least 0.0015 parts per million (ppm) of hafnium. Blown film made from the ethylene copolymer composition has a hot tack window (HTW) of at least 45° C. (at a film thickness of about 2 mil) and a seal initiation temperature (SIT) of less than 95° C. (at a film thickness of about 2 mil).