The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Dec. 16, 2016
Applicant:

Idemia France, Colombes, FR;

Inventor:

Denis Guerard, Colombes, FR;

Assignee:

IDEMIA FRANCE, Courbevoie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 33/00 (2006.01); B32B 37/02 (2006.01); B42D 25/45 (2014.01); G06K 19/077 (2006.01); B42D 25/455 (2014.01);
U.S. Cl.
CPC ...
B32B 37/0015 (2013.01); B32B 33/00 (2013.01); B32B 37/02 (2013.01); B42D 25/45 (2014.10); B42D 25/455 (2014.10); G06K 19/07722 (2013.01); G06K 19/07745 (2013.01); B32B 2305/342 (2013.01); B32B 2307/734 (2013.01); B32B 2307/75 (2013.01); B32B 2309/105 (2013.01); B32B 2327/06 (2013.01); B32B 2425/00 (2013.01);
Abstract

The method for producing a microcircuit card including a film having a very low level of shrinkage between two overlay layers, carrying at least one electronic component and an assembly of layers in which a cavity is formed containing the film and the electronic component, involves: forming the assembly to include a central layermade from a material having a very low level of shrinkage between two layers of a plastic material having a substantially higher level of shrinkage, for example PVC, forming, through the assembly, a cavity of which the surface area advantageously equals between 30% and 90% of the surface area of the outer faces of the microcircuit card that is to be produced, embedding the film and the electronic component in a resin so as to occupy the space in the cavity and laminating the two overlay layers.


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