The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Nov. 30, 2016
Applicant:
Materion Corporation, Mayfield Heights, OH (US);
Inventor:
Richard J. Koba, Saugus, MA (US);
Assignee:
Materion Corporation, Mayfield Heights, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); C09J 179/08 (2006.01); H05K 3/38 (2006.01); B32B 37/14 (2006.01); C04B 35/645 (2006.01); C04B 37/00 (2006.01); C04B 35/626 (2006.01); C04B 37/02 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 7/02 (2019.01); B32B 15/18 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 37/12 (2006.01); C25D 5/12 (2006.01); F28F 21/04 (2006.01); F28F 21/06 (2006.01); F28F 21/08 (2006.01); G03F 7/00 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H05K 1/03 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 7/02 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); B32B 37/12 (2013.01); B32B 37/144 (2013.01); C04B 35/6269 (2013.01); C04B 35/645 (2013.01); C04B 37/008 (2013.01); C04B 37/025 (2013.01); C04B 37/026 (2013.01); C04B 37/028 (2013.01); C09J 179/085 (2013.01); C25D 5/12 (2013.01); F28F 21/04 (2013.01); F28F 21/067 (2013.01); F28F 21/081 (2013.01); G03F 7/0035 (2013.01); H01L 21/4871 (2013.01); H01L 23/3735 (2013.01); H05K 3/386 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2307/202 (2013.01); B32B 2307/302 (2013.01); B32B 2307/732 (2013.01); B32B 2311/00 (2013.01); B32B 2311/04 (2013.01); B32B 2311/08 (2013.01); B32B 2311/09 (2013.01); B32B 2311/12 (2013.01); B32B 2311/22 (2013.01); B32B 2315/02 (2013.01); B32B 2379/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); C04B 2237/08 (2013.01); C04B 2237/086 (2013.01); C04B 2237/09 (2013.01); C04B 2237/121 (2013.01); C04B 2237/123 (2013.01); C04B 2237/124 (2013.01); C04B 2237/125 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/348 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/405 (2013.01); C04B 2237/406 (2013.01); C04B 2237/407 (2013.01); C04B 2237/408 (2013.01); C04B 2237/55 (2013.01); C04B 2237/56 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); F28F 2013/001 (2013.01); F28F 2275/025 (2013.01); H05K 1/0306 (2013.01); H05K 2201/026 (2013.01); H05K 2201/0215 (2013.01); Y10T 428/12569 (2015.01);
Abstract
A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.