The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Apr. 09, 2020
Polytronics Technology Corp., Hsinchu, TW;
Kuo-Hsun Chen, Toufen, TW;
Chia-Hsiung Wu, Miaoli County, TW;
Kai-Wei Lo, Taipei, TW;
Yu-Hsuan Tseng, Miaoli County, TW;
POLYTRONICS TECHNOLOGY CORP., Hsinchu, TW;
Abstract
A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and −1V. The microrough surface has a roughness Rz of 2-18 μm.