The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Feb. 16, 2018
Omron Corporation, Kyoto, JP;
Wakahiro Kawai, Konan, JP;
OMRON Corporation, Kyoto, JP;
Abstract
This method for manufacturing a resin structure () is provided with: a step for arranging a sheet () having a smooth surface () having a maximum height roughness of 3 μm or less, inside a forming mold () such that the smooth surface () faces an internal space () of the forming mold (); a step for molding a resin molded body () to which the sheet () is adhered, by filling the internal space () with a resin; a step for separating the resin molded body () from the sheet (), thereby forming a first region () having a maximum height roughness of 3 μm or less on at least a portion of the surface of the resin molded body (); and a step for using a fluid conductive ink to form a wiring () on the first region ().