The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Dec. 13, 2016
Applicant:

Nippon Polytech Corp., Hachioji, JP;

Inventors:

Kazuhiko Ooga, Tokyo, JP;

Naoki Murata, Tokyo, JP;

Kai Suzuki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/42 (2006.01); C08G 18/32 (2006.01); H05K 1/02 (2006.01); C08K 3/26 (2006.01); C08K 3/36 (2006.01); C08G 18/08 (2006.01); C08L 75/06 (2006.01); C08G 18/28 (2006.01); C09D 175/04 (2006.01); C08G 59/40 (2006.01); B05D 7/00 (2006.01); C09D 7/40 (2018.01); H05K 3/28 (2006.01); C08G 18/75 (2006.01); B05D 7/24 (2006.01); B32B 15/08 (2006.01); B41M 3/00 (2006.01); B41M 7/00 (2006.01); C08G 18/34 (2006.01); C08G 18/66 (2006.01); C09D 11/037 (2014.01); C09D 11/102 (2014.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B05D 7/00 (2013.01); B05D 7/24 (2013.01); B32B 15/08 (2013.01); B41M 3/006 (2013.01); B41M 7/009 (2013.01); C08G 18/0823 (2013.01); C08G 18/282 (2013.01); C08G 18/3215 (2013.01); C08G 18/348 (2013.01); C08G 18/4211 (2013.01); C08G 18/4213 (2013.01); C08G 18/6659 (2013.01); C08G 18/755 (2013.01); C08G 18/758 (2013.01); C08G 59/40 (2013.01); C08K 3/26 (2013.01); C08K 3/36 (2013.01); C08L 75/06 (2013.01); C09D 7/40 (2018.01); C09D 11/037 (2013.01); C09D 11/102 (2013.01); C09D 175/04 (2013.01); H05K 1/028 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 3/28 (2013.01); H05K 3/285 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/267 (2013.01); H05K 2203/1305 (2013.01);
Abstract

Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of Reach independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of Reach independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). Rrepresents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), Rrepresents a divalent organic group having 6-14 carbon atoms, and Rrepresents a methyl or ethyl group).


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