The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Jun. 23, 2020
Applicant:
Advanced Connectek Inc., New Taipei, TW;
Inventors:
Min-Lung Chien, New Taipei, TW;
Ta-Teh Meng, New Taipei, TW;
Mao-Sheng Chen, New Taipei, TW;
Wen-Yu Wang, New Taipei, TW;
Assignee:
Advanced Connectek Inc., New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/024 (2013.01); H05K 1/0219 (2013.01); H05K 1/0225 (2013.01); H05K 1/0277 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0715 (2013.01);
Abstract
A flexible circuit board including at least two electrical conducting layers, at least two non-electrical conducting layers, and at least one adhesion layer is provided. The non-electrical conducting layers are disposed between the electrical conducting layers. The non-electrical conducting layers are adhered together via the adhesion layer. A sum of thickness of the non-electrical conducting layers is greater than 4 mil, and there is no electrical conducting layer sandwiched between the at least two non-electrical conducting layers.