The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Nov. 10, 2017
Applicant:

Japan Aviation Electronics Industry, Limited, Tokyo, JP;

Inventors:

Shinichiro Nakajima, Tokyo, JP;

Ryosuke Mitsui, Tokyo, JP;

Junya Sato, Tokyo, JP;

Atsushi Tanaka, Tokyo, JP;

Noriyuki Mishina, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 1/04 (2006.01); H04R 7/04 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 1/04 (2013.01); H04R 7/04 (2013.01); H05K 1/028 (2013.01); H05K 1/189 (2013.01); H04R 2201/003 (2013.01); H05K 2201/10083 (2013.01);
Abstract

A base member with wiring and a microphone are provided. In the base member with wiring, an insulation adhesive layer, which is elastically deformable, is provided on one surface of a film, which has flexibility, and a conductor pattern is formed on the insulation adhesive layer. The microphone is mounted on the base member with wiring. A terminal of the microphone is in touch with the conductor pattern in face-to-face manner, and a part, on which the terminal is not formed, of a surface of the microphone and a part, on which the conductor pattern is not formed, of a surface of the insulation adhesive layer are bonded and mechanically coupled with each other.


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