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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11043883 B1

PDFFull Text
Date of Patent:
Jun. 22, 2021

Filed:

Nov. 27, 2016

Method for the production of a stack of laminations

Applicant:

Kienle + Spiess Gmbh, Sachsenheim, DE;

Inventors:

Daniel Blocher, Pürgen, DE;

Steffen Bauer, Zaberfeld, DE;

Andras Bardos, Heiligenhaus, DE;

Assignee:

Kienle + Spiess GmbH, Sachsenheim, DE;

Attorney:

Gudrun E. Huckett

Primary Examiner:

Thiem D Phan

Int. Cl.
CPC ...
H01F 3/04 (2006.01); H02K 15/12 (2006.01); H01F 3/02 (2006.01); H01F 41/02 (2006.01); H02K 15/02 (2006.01); B21D 28/02 (2006.01); B32B 7/14 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); H02K 1/18 (2006.01); H02K 1/28 (2006.01); C08G 59/40 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
H02K 15/12 (2013.01); B21D 28/02 (2013.01); B32B 7/14 (2013.01); B32B 27/308 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 37/1284 (2013.01); B32B 37/1292 (2013.01); B32B 38/0036 (2013.01); H01F 3/02 (2013.01); H01F 3/04 (2013.01); H01F 41/0233 (2013.01); H02K 1/18 (2013.01); H02K 1/28 (2013.01); H02K 15/02 (2013.01); B32B 2037/1253 (2013.01); B32B 2457/00 (2013.01); C08G 59/4042 (2013.01); C09J 163/00 (2013.01); Y10T 29/49078 (2015.01); Y10T 428/31515 (2015.04); Y10T 428/31551 (2015.04); Y10T 428/31938 (2015.04);
Abstract

In a method for manufacturing lamination stacks of controlled height in a tool, starting, material is provided as continuous strip delivered from a coil or as an individual sheet. Laminations are punched from the starting material in several punching steps to a required contour of the laminations. A heat-curing adhesive is applied onto the laminations prior to performing a last punching step. The laminations are combined to a lamination stack. The laminations of the lamination stack are partially or completely heated in a lamination storage. The adhesive is liquefied by heating the lamination stack to build up adhesion and then solidified. Curing the adhesive at the liquefying temperature or solidifying the adhesive in the tool by cooling and subsequently heating the adhesive to a temperature below the liquefying temperature is possible so that the adhesive does not melt but undergoes further curing resulting in higher temperature stability.

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