The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Nov. 11, 2019
Nichia Corporation, Anan, JP;
Mayumi Fukuda, Tokushima, JP;
NICHIA CORPORATION, Anan, JP;
Abstract
A method for manufacturing a package includes: preparing a lead frame that, in a region where the package is to be formed, has first and second electrodes, and has a through-hole at a position that spans across outer edges of the region; clamping the first and second electrodes between upper and lower molding dies; injecting a first resin into the molding dies, through an injection opening formed adjacent to the first electrode and on the outside of the region, so that the first resin has a wall that constitutes a side wall of a bottomed concave component with an outer lead component protruding outward from the wall, and a height of the side wall is larger than a thickness of the outer lead component; curing or solidifying the injected first resin; and cutting out an injection mark by cutting the lead frame at the outer edges of the region.