The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Aug. 28, 2020
Applicants:

Zhejiang Jinko Solar Co., Ltd., Haining, CN;

Jinko Solar Co., Ltd., Jiangxi, CN;

Inventors:

Luchuang Wang, Haining, CN;

Wusong Tao, Haining, CN;

Zhiqiu Guo, Haining, CN;

Yang Bai, Haining, CN;

Xueming Zhang, Haining, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/05 (2014.01); H01L 31/048 (2014.01);
U.S. Cl.
CPC ...
H01L 31/188 (2013.01); H01L 31/048 (2013.01); H01L 31/0504 (2013.01); H01L 31/186 (2013.01);
Abstract

The present disclosure relates to a method and apparatus for manufacturing a semiconductor sheet assembly. The method for manufacturing a semiconductor sheet assembly includes positioning a semiconductor sheet, and determining a first region to be grooved and a defect position in the first region; cutting and grooving the semiconductor sheet along the defect position in the first region; and splitting the semiconductor sheet that is cut and grooved.


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