The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Sep. 03, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Shoji Matsumoto, Fujisawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/66 (2006.01); H05K 1/14 (2006.01); H01P 3/06 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 23/66 (2013.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01P 3/06 (2013.01); H05K 1/0277 (2013.01); H05K 1/14 (2013.01); H05K 1/181 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6638 (2013.01);
Abstract

A transmission circuit includes a first semiconductor device, a second semiconductor device, a first signal line, a second signal line, a third signal line, and a ground line. A differential signal is composed of a first signal and a second signal. The first signal line is configured to connect the first semiconductor device and the second semiconductor device and used to transmit the first signal. The second signal line is configured to connect the first semiconductor device and the second semiconductor device and used to transmit the second signal. The second signal line, the first signal line, the ground line, and the third signal line are disposed in this order. A distance between the first signal line and the ground line is larger than a distance between the first signal line and the second signal line.


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