The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
May. 14, 2019
Applicant:
Olympus Corporation, Tokyo, JP;
Inventor:
Takashi Nakayama, Ina, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 27/146 (2006.01); A61B 1/00 (2006.01); A61B 1/05 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); A61B 1/0011 (2013.01); A61B 1/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13015 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13027 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/325 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81141 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/831 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/9211 (2013.01);
Abstract
A device-bonded body includes: a first device where a plated bump is disposed; a second device where a bonding electrode bonded to the plated bump is disposed; and a sealing layer made of NCF or NCP, the sealing layer being disposed between the first device and the second device and including filler particles made of inorganic material; wherein a surface of the plated bump includes a first area and a second area higher than the first area; and at least a part of a side surface of an outer circumferential portion of the second area intersects with a surface of the first area.