The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Nov. 22, 2017
Applicant:
Dexerials Corporation, Shinagawa-ku Tokyo, JP;
Inventors:
Tatsuo Kumura, Tokyo, JP;
Hiroyuki Ryoson, Tokyo, JP;
Assignee:
Dexerials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/373 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/373 (2013.01); H05K 7/20 (2013.01); H05K 9/0081 (2013.01);
Abstract
Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor devicecomprises: a semiconductor elementformed on a substrate; a conductive shield canhaving an opening, covering at least a part of the semiconductor element, and connected to a ground; a cooling memberlocated above the conductive shield can; and an electromagnetic wave absorbing thermal conductive sheetformed between the semiconductor elementand the cooling memberat least through the openingof the conductive shield can