The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Oct. 24, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jungsoo Park, Suwon-si, KR;
Kyoungmoo Harr, Suwon-si, KR;
Jihyun Lee, Suwon-si, KR;
Doohwan Lee, Suwon-si, KR;
Junggon Choi, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a connection structure including a first insulating layer, a first redistribution layer disposed on the first insulating layer, and a first connection via penetrating through the first insulating layer and connected to the first redistribution layer, a semiconductor chip disposed on the connection structure, an encapsulant covering at least a portion of the semiconductor chip, a second insulating layer disposed on the encapsulant, a second redistribution layer including a signal line disposed on the encapsulant, and a heat dissipation layer disposed on the encapsulant and electrically insulated from the signal line.