The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Mar. 11, 2019
Applicant:
Huawei Technologies Co., Ltd., Guangdong, CN;
Inventors:
Assignee:
Huawei Technologies Co., Ltd., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/40 (2006.01); H01L 23/467 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01); F28F 3/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); F28F 3/06 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H05K 7/20 (2013.01); F28F 2280/02 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01);
Abstract
One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.