The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Mar. 06, 2019
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventor:
Ippei Kume, Yokkaichi, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 21/311 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/31144 (2013.01); H01L 21/486 (2013.01); H01L 21/76802 (2013.01); H01L 21/76831 (2013.01); H01L 21/76832 (2013.01); H01L 23/481 (2013.01); H01L 23/5384 (2013.01); H01L 23/53295 (2013.01);
Abstract
A semiconductor device according to an embodiment comprises a semiconductor substrate having a through hole from a first face to a second face on an opposite side to the first face. A metal part is provided inside the through hole. A stacked film is provided between the metal part and an inner side surface of the through hole, and comprises a plurality of different material films of two or more types having a relative permittivity equal to or lower than 6.5.