The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Jul. 24, 2018
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Seiichiro Tachibana, Jyoetsu, JP;

Hiroko Nagai, Jyoetsu, JP;

Daisuke Kori, Jyoetsu, JP;

Tsutomu Ogihara, Jyoetsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/09 (2006.01); G03F 7/16 (2006.01); C08G 16/02 (2006.01); C09D 161/00 (2006.01); C08G 8/22 (2006.01); C08G 8/20 (2006.01); C08G 8/04 (2006.01); C09D 161/12 (2006.01); G03F 7/075 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C08G 8/04 (2013.01); C08G 8/20 (2013.01); C08G 8/22 (2013.01); C08G 16/0237 (2013.01); C09D 161/00 (2013.01); C09D 161/12 (2013.01); G03F 7/0752 (2013.01); G03F 7/094 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01);
Abstract

The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.


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