The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Dec. 10, 2018
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Ken Yamamoto, Nagano, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 7/02 (2021.01); B29D 11/00 (2006.01); G02B 23/24 (2006.01); G02B 23/26 (2006.01); A61B 1/00 (2006.01); G02B 3/00 (2006.01); A61B 1/05 (2006.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
G02B 23/243 (2013.01); A61B 1/0011 (2013.01); A61B 1/00096 (2013.01); B29D 11/0074 (2013.01); B29D 11/00307 (2013.01); B29D 11/00403 (2013.01); G02B 3/0037 (2013.01); G02B 7/02 (2013.01); G02B 23/2423 (2013.01); G02B 23/26 (2013.01); A61B 1/051 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H04N 5/2254 (2013.01); H04N 2005/2255 (2013.01);
Abstract

A manufacturing method of an optical unit for endoscope includes: a process of crimping a bonding sheet including a curable resin film to a release substrate having a release surface which is an optical flat surface; a mirror-finishing process of performing a partial curing treatment on a predetermined region of the bonding sheet to process the predetermined region into an optical flat surface; a process of fabricating a laminated wafer by laminating a first element wafer including a first optical element and a second element wafer including a second optical element, with the bonding sheet being arranged between the first element wafer and the second element wafer; a curing process of performing a curing treatment on an uncured region of the bonding sheet; and a process of cutting the laminated wafer and segmenting the laminated wafer into optical units.


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