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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11041229 B1

PDFFull Text
Date of Patent:
Jun. 22, 2021

Filed:

Aug. 31, 2017

Silver-coated alloy powder, electrically conductive paste, electronic part, and electric device

Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Kyoso Masuda, Tokyo, JP;

Kenichi Inoue, Tokyo, JP;

Yuki Kaneshiro, Tokyo, JP;

Atsushi Ebara, Tokyo, JP;

Yoshiyuki Michiaki, Tokyo, JP;

Kozo Ogi, Tokyo, JP;

Takahiro Yamada, Tokyo, JP;

Masahiro Yoshida, Tokyo, JP;

Assignee:

DOWA ELECTRONICS MATERIALS CO., LTD., Tokyo, JP;

Attorney:

Greenblum & Bernstein P.L.C.

Primary Examiner:

Hoa (Holly) Le

Int. Cl.
CPC ...
B32B 5/16 (2006.01); C22C 9/06 (2006.01); B22F 1/00 (2006.01); H01G 4/232 (2006.01); H01B 5/00 (2006.01); H01B 1/00 (2006.01); C22C 9/00 (2006.01); H01G 4/30 (2006.01); C22C 9/04 (2006.01); B22F 1/02 (2006.01); H01B 1/22 (2006.01); H01G 4/228 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C22C 9/06 (2013.01); B22F 1/00 (2013.01); B22F 1/0011 (2013.01); B22F 1/02 (2013.01); B22F 1/025 (2013.01); C22C 9/00 (2013.01); C22C 9/04 (2013.01); H01B 1/00 (2013.01); H01B 1/22 (2013.01); H01B 5/00 (2013.01); H01G 4/228 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/097 (2013.01); B22F 2301/255 (2013.01); B22F 2304/10 (2013.01);
Abstract

An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.

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