The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Jul. 24, 2014
Applicant:
Toyo Seikan Group Holdings, Ltd., Tokyo, JP;
Inventors:
Yosuke Akutsu, Yokohama, JP;
Shinya Iwamoto, Yokohama, JP;
Assignee:
TOYO SEIKAN GROUP HOLDINGS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 7/04 (2020.01); C08J 7/06 (2006.01); B65D 23/02 (2006.01); B65D 23/04 (2006.01); B65D 85/72 (2006.01); C08J 7/048 (2020.01); B65D 1/02 (2006.01); B32B 27/30 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); B32B 3/26 (2006.01); B32B 27/08 (2006.01); C08J 7/043 (2020.01); C08J 7/046 (2020.01);
U.S. Cl.
CPC ...
C08J 7/048 (2020.01); B32B 3/266 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B65D 1/0215 (2013.01); C08J 7/043 (2020.01); C08J 7/046 (2020.01); C08J 7/065 (2013.01); B32B 2264/102 (2013.01); B32B 2439/70 (2013.01); C08J 2323/06 (2013.01); C08J 2423/06 (2013.01); C08J 2433/12 (2013.01);
Abstract
A resin structure comprising a resin formed body () and a liquid layer () formed on a surface of the resin formed body (), the liquid layer () having liquid protrusions () that are locally protruded on the surface thereof. The structure exhibits improved properties on the surface of the resin formed body (), such as improved sliding property and non-adhesiveness to various substances maintaining stability as a result of forming the liquid layer ().