The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11040467 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 22, 2021

Filed:

Dec. 17, 2020
Applicants:

Bombardier Transportation Gmbh, Berlin, DE;

Bell Textron Inc., Mirabel, CA;

Inventors:

Daniel Poirier, Mirabel, CA;

Hubert Michaud, Boisbriand, CA;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/38 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B29C 70/46 (2006.01);
U.S. Cl.
CPC ...
B29C 33/3842 (2013.01); B29C 70/46 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

An open mold for producing components made of a moldable material such as layered composite materials is made from an additive manufacturing technology. The mold includes at least two compatible mold segments which precisely interlock with and abut against each other. The mold thereby made may be larger than the limited printing area of an additive manufacturing machine.


Find Patent Forward Citations

Poirier, Daniel. (2021). Mold made from an additive manufacturing technology (U.S. Patent No. 11040467). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11040467

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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