The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Nov. 22, 2015
Applicants:
Nano-dimension Technologies, Ltd., Nes Ziona, IL;
The Ip Law Firm of Guy Levi, Llc, Wyckoff, NJ (US);
Inventors:
Sharon Fima, Moshav Neta'im, IL;
Hila Elimelech, Moshav Avigdor, IL;
Assignee:
Nano Dimension Technologies, LTD., Nes Ziona, IL;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); B33Y 80/00 (2015.01); B41M 3/00 (2006.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); C09D 11/30 (2014.01); C09D 11/52 (2014.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4664 (2013.01); B33Y 80/00 (2014.12); B41M 3/006 (2013.01); C09D 11/101 (2013.01); C09D 11/107 (2013.01); C09D 11/30 (2013.01); C09D 11/52 (2013.01); H05K 1/097 (2013.01); H05K 3/0055 (2013.01); H05K 3/125 (2013.01); H05K 3/4682 (2013.01); H05K 3/207 (2013.01); H05K 2201/0257 (2013.01); H05K 2203/013 (2013.01);
Abstract
The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.