The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
May. 15, 2018
Applicant:
Flex Ltd., Singapore, SG;
Inventors:
Jesus Tan, San Jose, CA (US);
Anwar Mohammed, San Jose, CA (US);
David Geiger, Dublin, CA (US);
Weifeng Liu, Dublin, CA (US);
Assignee:
Flex Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 5/06 (2006.01); H05K 3/12 (2006.01); H05K 3/30 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H05K 1/0266 (2013.01); H05K 1/092 (2013.01); H05K 1/181 (2013.01); H05K 3/1216 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 5/065 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/09936 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract
An In-Mold Electronics (IME) device and method of manufacturing the IME device introduce a stretchable substrate laminated to a thermoplastic layer. The stretchable substrate has a screen printable surface for receiving printed conductive interconnects. This combination enables formation of an IME device with conductive interconnects oriented for hard to reach cavities and areas. The IME device eliminates the need to have additional mold features to enable deeper drawn cavities.