The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Jun. 24, 2019
Skyworks Solutions, Inc., Irvine, CA (US);
Anthony James LoBianco, Irvine, CA (US);
Hoang Mong Nguyen, Fountain Valley, CA (US);
Skyworks Solutions, Inc., Irvine, CA (US);
Abstract
A packaged radio frequency module includes a package substrate. A semiconductor die is attached to the package substrate and includes one or more radio frequency circuits fabricated therein. A molding compound encapsulates the semiconductor die. An electromagnetic shielding structure at least partially covers the molding compound, the electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.