The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Mar. 09, 2018
Applicant:

Ewha University—industry Collaboration Foundation, Seoul, KR;

Inventors:

Sang Wook Lee, Seoul, KR;

Dong Hoon Shin, Uiwang-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C01B 32/194 (2017.01); H01L 21/322 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0013 (2013.01); C01B 32/194 (2017.08); H01L 21/3221 (2013.01); H01L 51/0025 (2013.01);
Abstract

Provided are a method for manufacturing an electronic device capable of efficiently utilizing a material and a method for removing impurities using the same. The method for manufacturing an electronic device comprises the steps of: placing a transfer film on a plurality of functional layers which are positioned apart from each other on a source substrate; bringing a first transfer target into close contact with the lower surface of the transfer film by applying pressure to a portion of the transfer film that corresponds to the first transfer target from among the plurality of functional layers by using a probe; separating the transfer film from the source substrate in a state in which the first transfer target is in close contact with the lower surface; placing the transfer film on a target substrate in the state in which the first transfer target is in close contact with the lower surface; placing the first transfer target on the target substrate by applying pressure to a portion of the transfer film that corresponds to the first transfer target; and separating the transfer film from the target substrate in a state in which the first transfer target is positioned on the target surface.


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